RESIN PASTE FOR DIE BONDING, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE BY USING THE SAME, AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a paste easily being supplied/coated by a printing method to a supporting member required to be stuck at a comparatively low temperature, enabling steps of the conversion to a B stage and post-curing to be carried out by different methods to shorten the time for a B stage step, having good adhesive strength, and suppressing voids and thinning of a film after curing; to provide a method for producing a semiconductor device by using the paste; and to provide the semiconductor device. SOLUTION: The resin paste for die bonding comprises (A) an acrylic ester compound or a methacrylic ester compound, (B) an epoxidated polybutadiene or a carboxy-terminated acrylonitrile-butadiene copolymer, (C) a photopolymerization initiator, (D) a thermosetting resin and (E) a filler. The method for producing the semiconductor device by using the resin paste, and the semiconductor device are also provided. COPYRIGHT: (C)2008,JPO&INPIT