SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, CIRCUIT BOARD, AND ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To enhance bonding strength of upper and lower interposers when each of a plurality of semiconductor chips is supported by the interposers. SOLUTION: The thermal expansion coefficient of a first package 10 is larger than that of a second package 30. The second package 30 is arranged so that the second interposer 32 overlaps above a first semiconductor chip 16 and a first interposer 12. A contact 46 is provided between the first interposer 12 and a second interposer 32, so that a first end 47 connects to a first wiring pattern 14 and a second end 48 connects to a second wiring pattern 34. A reinforced part 50 is provided so as to expose part of the contact 46, and to cover the end 47 of the contact 46. COPYRIGHT: (C)2008,JPO&INPIT