FILM-FORMING COMPOSITION

PROBLEM TO BE SOLVED: To provide a film-forming composition for producing an insulating film excellent from the viewpoint of film properties such as a dielectric constant or metal diffusion barrier insulation properties. SOLUTION: The film-forming composition comprises at least one solvent selected...

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Bibliographische Detailangaben
1. Verfasser:	ADEGAWA YUTAKA
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a film-forming composition for producing an insulating film excellent from the viewpoint of film properties such as a dielectric constant or metal diffusion barrier insulation properties. SOLUTION: The film-forming composition comprises at least one solvent selected from among 8-18C hydrocarbons and 4-10C alcohols, where the hydrocarbons and alcohols contain neither a carbonyl site nor an ether linkage site as a substituent group in the molecule. COPYRIGHT: (C)2008,JPO&INPIT