SUCKING APPARATUS, POLISHING APPARATUS, SEMICONDUCTOR-DEVICE MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURED BY SAME METHOD

PROBLEM TO BE SOLVED: To provide a sucking apparatus capable of improving the accuracy of a working performed by polishing. SOLUTION: The sucking apparatus 50 is the one so constituted as to hold a semiconductor wafer by vacuum-sucking the semiconductor wafer by using a vacuum source. Further, the s...

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Hauptverfasser:	EZAKI MORIHIKO, ASADA NAOKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a sucking apparatus capable of improving the accuracy of a working performed by polishing. SOLUTION: The sucking apparatus 50 is the one so constituted as to hold a semiconductor wafer by vacuum-sucking the semiconductor wafer by using a vacuum source. Further, the sucking apparatus 50 is so constituted as to have a circular-plate-form sucking base material 51 for sucking and holding the semiconductor wafer, and as to have a resin coating layer 65 provided on the surface side of the sucking base material 51 on whose surface a sucking surface 67 for contacting with the sucked surface of the semiconductor wafer is formed. COPYRIGHT: (C)2008,JPO&INPIT