PARTICLE DEPOSITION METHOD

PARTICLE DEPOSITION METHOD

PROBLEM TO BE SOLVED: To provide a method of efficiently depositing particles inside openings of a resist by scattering the particles on a substrate coated with the resist having the openings. SOLUTION: In the method of depositing particles inside the openings of the resist by scattering the particl...

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Bibliographische Detailangaben
1. Verfasser: ITABASHI KAZUMITSU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method of efficiently depositing particles inside openings of a resist by scattering the particles on a substrate coated with the resist having the openings. SOLUTION: In the method of depositing particles inside the openings of the resist by scattering the particles on the substrate coated with the resist having the openings, the particles are scattered after applying flux inside the openings. The flux has a kinematic viscosity adjusted to 1-20 mm2/s. For scattering the particles, the particles can be blasted using a gas pressure. Preferably, vibration is applied to the substrate during the scattering of the particles. COPYRIGHT: (C)2008,JPO&INPIT