WIRING BOARD

WIRING BOARD

PROBLEM TO BE SOLVED: To provide a wiring board which improves the adhesion between a board body containing a glass component and pads formed on the board body at high density, and enhances the soldering strength of an external terminal soldered to each pad. SOLUTION: The wiring board 1 includes the...

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Hauptverfasser: IGAWA TATSUHARU, SHIRAISHI MITSUO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator IGAWA TATSUHARU
SHIRAISHI MITSUO
description PROBLEM TO BE SOLVED: To provide a wiring board which improves the adhesion between a board body containing a glass component and pads formed on the board body at high density, and enhances the soldering strength of an external terminal soldered to each pad. SOLUTION: The wiring board 1 includes the board body 2 containing the glass component and having a front surface 3 and a back surface 4, the pads 20 exposing out of the back surface 4 of the board body 2, and the external terminals 26 each having a nail 28 soldered above the pad 20 via solder 23 and a shank 26a extending from the nail 28. The ratio d/D between the diameter d of the nail 28 of the external terminal 26 and the diameter D of the pad 20 exposing out of the back surface 4 of the board body 2 is within the range of 0.5≤d/D
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SOLUTION: The wiring board 1 includes the board body 2 containing the glass component and having a front surface 3 and a back surface 4, the pads 20 exposing out of the back surface 4 of the board body 2, and the external terminals 26 each having a nail 28 soldered above the pad 20 via solder 23 and a shank 26a extending from the nail 28. The ratio d/D between the diameter d of the nail 28 of the external terminal 26 and the diameter D of the pad 20 exposing out of the back surface 4 of the board body 2 is within the range of 0.5≤d/D&lt;1.0. The hardness Hv of the external terminal 26 is within the range of 50 Hv≤Hv&lt;100 Hv. The melting temperature of the solder 23 is lower than the softening point of the glass component contained in the board body 2. 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SOLUTION: The wiring board 1 includes the board body 2 containing the glass component and having a front surface 3 and a back surface 4, the pads 20 exposing out of the back surface 4 of the board body 2, and the external terminals 26 each having a nail 28 soldered above the pad 20 via solder 23 and a shank 26a extending from the nail 28. The ratio d/D between the diameter d of the nail 28 of the external terminal 26 and the diameter D of the pad 20 exposing out of the back surface 4 of the board body 2 is within the range of 0.5≤d/D&lt;1.0. The hardness Hv of the external terminal 26 is within the range of 50 Hv≤Hv&lt;100 Hv. The melting temperature of the solder 23 is lower than the softening point of the glass component contained in the board body 2. 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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title WIRING BOARD
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