WIRING BOARD

PROBLEM TO BE SOLVED: To provide a wiring board which improves the adhesion between a board body containing a glass component and pads formed on the board body at high density, and enhances the soldering strength of an external terminal soldered to each pad. SOLUTION: The wiring board 1 includes the...

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Bibliographische Detailangaben
Hauptverfasser: IGAWA TATSUHARU, SHIRAISHI MITSUO
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a wiring board which improves the adhesion between a board body containing a glass component and pads formed on the board body at high density, and enhances the soldering strength of an external terminal soldered to each pad. SOLUTION: The wiring board 1 includes the board body 2 containing the glass component and having a front surface 3 and a back surface 4, the pads 20 exposing out of the back surface 4 of the board body 2, and the external terminals 26 each having a nail 28 soldered above the pad 20 via solder 23 and a shank 26a extending from the nail 28. The ratio d/D between the diameter d of the nail 28 of the external terminal 26 and the diameter D of the pad 20 exposing out of the back surface 4 of the board body 2 is within the range of 0.5≤d/D