SEMICONDUCTOR DEVICE AND ITS MANUFACTURING PROCESS

PROBLEM TO BE SOLVED: To provide a compact and highly integrated semiconductor device in which a semiconductor chip including an SAW element or a function element such as an F-BAR having an oscillator or a movable portion on the function surface is built in while being sealed hermetically, and to provide its manufacturing process. SOLUTION: A first semiconductor chip 10 having a first active surface on which a bump electrode 12 is formed and a second semiconductor chip 20 having a second active surface are connected through the bump electrode 12 such that the first active surface and the second active surface oppose each other. A resin layer 34 is formed to cover the first semiconductor chip 10 and the second semiconductor chip 20 excepting the gap between the first active surface and the second active surface and to constitute a hollow portion 35 by sealing that gap. A function element 13 having a movable portion or an oscillator on at least any one of the first active surface and the second active surface is formed in the hollow portion 35. COPYRIGHT: (C)2007,JPO&INPIT