HEAT SHIELD PLATE FOR USE IN SUBSTRATE ANNEALING DEVICE

PROBLEM TO BE SOLVED: To provide a heat shield plate for use in a substrate annealing device which has small thermal deformation, does not oxidize (burn out) and can be enlarged in size and reduced in weight, even if one of its surfaces is exposed to a high temperature (around approx. 750°C for exam...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HASHIMOTO KOJI, MORITA MASARU, ISHIHARA TERUMASA, MIZUNO MASAYUKI
Format: Patent
Sprache:eng
Schlagworte:
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