HEAT SHIELD PLATE FOR USE IN SUBSTRATE ANNEALING DEVICE

PROBLEM TO BE SOLVED: To provide a heat shield plate for use in a substrate annealing device which has small thermal deformation, does not oxidize (burn out) and can be enlarged in size and reduced in weight, even if one of its surfaces is exposed to a high temperature (around approx. 750°C for exam...

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Bibliographische Detailangaben
Hauptverfasser: HASHIMOTO KOJI, MORITA MASARU, ISHIHARA TERUMASA, MIZUNO MASAYUKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a heat shield plate for use in a substrate annealing device which has small thermal deformation, does not oxidize (burn out) and can be enlarged in size and reduced in weight, even if one of its surfaces is exposed to a high temperature (around approx. 750°C for example) and the other surface is exposed to a much lower temperature to cause a large temperature difference (approx. 350°C or more for example) between both surfaces. SOLUTION: The heat shield plate for use in the substrate annealing device has a horizontally supported planar substrate 1, a heater 5 located above the substrate for heating the upper surface of the substrate by radiation heat, and a heat shield plate 10 capable of horizontally moving between a shielding position for shielding the substrate and the heater and an open position deviating therefrom. The heat shield plate 10 consists of a structural member 12 constituted of a low-thermal expansion material (carbon composite material) which rarely deforms by a temperature difference at the shielding position, and a heat insulating member 14 for covering the upper surface of the structural member for keeping it at its allowable temperature or lower. COPYRIGHT: (C)2007,JPO&INPIT