MOTHER BOARD PROCESSING DIE, METHOD OF MANUFACTURING PROCESS BOARD, AND METHOD OF MANUFACTURING PRODUCT BOARD

PROBLEM TO BE SOLVED: To provide a mother board processing die which has no need of remaking the entire die even when the shape or size of a printed circuit board changes or the size of a mounting board changes, and methods of manufacturing a process board and product board, using the same. SOLUTION...

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Bibliographische Detailangaben

1. Verfasser:	IWAMOTO KATSUHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CUTTING CUTTING-OUT ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND CUTTING TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORATING PERFORMING OPERATIONS PRINTED CIRCUITS PUNCHING SEVERING SEVERING BY MEANS OTHER THAN CUTTING STAMPING-OUT TRANSPORTING
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