MOTHER BOARD PROCESSING DIE, METHOD OF MANUFACTURING PROCESS BOARD, AND METHOD OF MANUFACTURING PRODUCT BOARD

PROBLEM TO BE SOLVED: To provide a mother board processing die which has no need of remaking the entire die even when the shape or size of a printed circuit board changes or the size of a mounting board changes, and methods of manufacturing a process board and product board, using the same. SOLUTION: In the mother board processing die 1 along the transport direction of a mother board a pushback part 3, an idling region 7 and an outer shape cutting part 5 are disposed in this order, the pushback part 3 may be replaced with any means for pushing back printed circuit boards different in shape and/or disposition, the cutting part 5 has a cutting line forming means for forming elongated holes and small holes dispersively on and near a cutting line for obtaining narrow mounting boards when the pushback 3 is replaced with any means for pushing back the printed circuit boards from a narrow area, and the cutting line forming means is removable from the outer shape cutting part 5. COPYRIGHT: (C)2007,JPO&INPIT