MOTHER BOARD PROCESSING DIE, METHOD OF MANUFACTURING PROCESS BOARD, AND METHOD OF MANUFACTURING PRODUCT BOARD
PROBLEM TO BE SOLVED: To provide a mother board processing die which has no need of remaking the entire die even when the shape or size of a printed circuit board changes or the size of a mounting board changes, and methods of manufacturing a process board and product board, using the same. SOLUTION...
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| creator | IWAMOTO KATSUHIKO |
| description | PROBLEM TO BE SOLVED: To provide a mother board processing die which has no need of remaking the entire die even when the shape or size of a printed circuit board changes or the size of a mounting board changes, and methods of manufacturing a process board and product board, using the same. SOLUTION: In the mother board processing die 1 along the transport direction of a mother board a pushback part 3, an idling region 7 and an outer shape cutting part 5 are disposed in this order, the pushback part 3 may be replaced with any means for pushing back printed circuit boards different in shape and/or disposition, the cutting part 5 has a cutting line forming means for forming elongated holes and small holes dispersively on and near a cutting line for obtaining narrow mounting boards when the pushback 3 is replaced with any means for pushing back the printed circuit boards from a narrow area, and the cutting line forming means is removable from the outer shape cutting part 5. COPYRIGHT: (C)2007,JPO&INPIT |
| format | Patent |
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SOLUTION: In the mother board processing die 1 along the transport direction of a mother board a pushback part 3, an idling region 7 and an outer shape cutting part 5 are disposed in this order, the pushback part 3 may be replaced with any means for pushing back printed circuit boards different in shape and/or disposition, the cutting part 5 has a cutting line forming means for forming elongated holes and small holes dispersively on and near a cutting line for obtaining narrow mounting boards when the pushback 3 is replaced with any means for pushing back the printed circuit boards from a narrow area, and the cutting line forming means is removable from the outer shape cutting part 5. 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SOLUTION: In the mother board processing die 1 along the transport direction of a mother board a pushback part 3, an idling region 7 and an outer shape cutting part 5 are disposed in this order, the pushback part 3 may be replaced with any means for pushing back printed circuit boards different in shape and/or disposition, the cutting part 5 has a cutting line forming means for forming elongated holes and small holes dispersively on and near a cutting line for obtaining narrow mounting boards when the pushback 3 is replaced with any means for pushing back the printed circuit boards from a narrow area, and the cutting line forming means is removable from the outer shape cutting part 5. 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SOLUTION: In the mother board processing die 1 along the transport direction of a mother board a pushback part 3, an idling region 7 and an outer shape cutting part 5 are disposed in this order, the pushback part 3 may be replaced with any means for pushing back printed circuit boards different in shape and/or disposition, the cutting part 5 has a cutting line forming means for forming elongated holes and small holes dispersively on and near a cutting line for obtaining narrow mounting boards when the pushback 3 is replaced with any means for pushing back the printed circuit boards from a narrow area, and the cutting line forming means is removable from the outer shape cutting part 5. COPYRIGHT: (C)2007,JPO&INPIT</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CUTTING CUTTING-OUT ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND CUTTING TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORATING PERFORMING OPERATIONS PRINTED CIRCUITS PUNCHING SEVERING SEVERING BY MEANS OTHER THAN CUTTING STAMPING-OUT TRANSPORTING |
| title | MOTHER BOARD PROCESSING DIE, METHOD OF MANUFACTURING PROCESS BOARD, AND METHOD OF MANUFACTURING PRODUCT BOARD |
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