PHOTOSENSITIVE THERMOSETTING RESIN COMPOSITION, SMOOTHED PRINTED WIRING BOARD COATED WITH RESIST FILM AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a photosensitive thermosetting resin composition capable of giving a solder resist film for a printed wiring board of LED. SOLUTION: The photosensitive thermosetting resin composition contains [I] an alkoxy group-containing silane modified epoxy resin obtained by bringing an epoxy resin represented by formula (I/E) and a hydrolyzable alkoxysilane into a dealcoholization reaction, [II] an unsaturated group-containing polycarboxylic acid resin, [III] a diluent, [IV] a photopolymerization initiator and [V] a curing adhesion imparting agent. The composition has a weight ratio between the component [I] and the component [II] being 2:100 to 50:100, and contains the component [III] in an amount of 5-500 pts.wt., the component [IV] in an amount of 0.1-30 pts.wt., and the component [V] in an amount of 0.1-20 pts.wt., based on 100 pts.wt., in total, of the component [I] and the component [II]. In the formula, G represents glycidyl; a11A11, a12A13and A15each independently represent a divalent aromatic residue or a divalent hydrogenated aromatic residue; a11A12and a12A14each independently represent H or G, provided that at least one of a11A12and a12A14is H or all of these may be H at the same time; and average numbers of repeating units a11and a12each independently represent a number of ≥0, provided that a11and a12are not 0 at the same time and the summation of a11and a12is ≤20. COPYRIGHT: (C)2007,JPO&INPIT