COVER TAPE FOR PACKAGING SEMICONDUCTOR DEVICE, AND WRAPPER FOR SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a cover tape for packaging a semiconductor device and a wrapper for a semiconductor device, which protect an outer shape of the semiconductor device, assure both quality and reliability of the semiconductor device, and improve an actual installation speed of the semi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ANDO YUKIO, YAZAKI KENICHI, HASHIBA HIDEYASU, HAMANAKA YUZO, SASAMURA KEIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS STORING TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a cover tape for packaging a semiconductor device and a wrapper for a semiconductor device, which protect an outer shape of the semiconductor device, assure both quality and reliability of the semiconductor device, and improve an actual installation speed of the semiconductor through a taping shipment. SOLUTION: The cover tape for packaging a semiconductor device of the present invention is bonded to cover a plurality of storing segments in an embossed tape having the storing segments for storing the semiconductor device, and a net structure 20 is arranged in at least a part of it. The wrapper for the semiconductor is comprised of the embossed tape having a plurality of storing segments for storing the semiconductor and the cover tape for packaging the semiconductor device. COPYRIGHT: (C)2007,JPO&INPIT