MANUFACTURING METHOD OF FLEXIBLE COPPER CLAD LAMINATE SUBSTRATE

PROBLEM TO BE SOLVED: To provide a flexible copper clad laminate substrate which prevents generation of a curl when a carrier is peeled after a solution of a polyimide resin or the like is applied on extremely thin copper foil with a carrier to form a resin layer, and shows excellent workability in fine circuit formation. SOLUTION: When the resin solution is applied on the extremely thin copper foil of the extremely thin copper foil with the carrier made by forming the extremely thin copper foil on the heat-resistant carrier via a peeling layer, drying and heat-treating it to produce a multi-layered laminate having one or more resin layers formed on the extremely thin copper foil with the carrier, and then the carrier is peeled from the multi-layered laminate to produce the flexible copper clad laminate substrate, the peeled flexible copper clad laminate substrate is let to advance in the range of ±20 degrees to the advance direction of the multi-layered laminate at the peeling position, and the peeling angle θ of the carrier is 140 degrees ≤θ≤180 degrees to the advance direction of the copper clad laminate substrate. COPYRIGHT: (C)2007,JPO&INPIT