CLEANING COMPOSITION

PROBLEM TO BE SOLVED: To provide an aqueous cleaning composition which is used for removing unwanted organic and inorganic residues and contaminants from semiconductor substrates. SOLUTION: The cleaning composition comprises a component, such urea derivatives, for example, dimethyl urea, as the comp...

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Bibliographische Detailangaben
Hauptverfasser:	LISTEMANN MARK L, RAO MADHUKAR BHASKARA, WIEDER THOMAS MICHAEL, MARSELLA JOHN ANTHONY
Format:	Patent
Sprache:	eng
Schlagworte:	ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CANDLES CHEMISTRY CINEMATOGRAPHY DETERGENT COMPOSITIONS DETERGENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY FATTY ACIDS THEREFROM HOLOGRAPHY MATERIALS THEREFOR METALLURGY ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS RECOVERY OF GLYCEROL RESIN SOAPS SEMICONDUCTOR DEVICES SOAP OR SOAP-MAKING USE OF SINGLE SUBSTANCES AS DETERGENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an aqueous cleaning composition which is used for removing unwanted organic and inorganic residues and contaminants from semiconductor substrates. SOLUTION: The cleaning composition comprises a component, such urea derivatives, for example, dimethyl urea, as the component that is principally responsible for removing organic residues from the substrate. A fluoride ion source is also included in the cleaning compositions and is principally responsible for removing inorganic residues from the substrate. The cleaning compositions have low toxicity and are environmentally allowable. COPYRIGHT: (C)2007,JPO&INPIT