WIRING BOARD, AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a wiring board excellent in resistance to migration, and to provide its manufacturing method. SOLUTION: The wiring board 10 at least includes a conductive film 13 provided on one of surfaces 11a of a base material 11 and made of conductive particles 15, and a metalli...

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1. Verfasser:	ONO AKINOBU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a wiring board excellent in resistance to migration, and to provide its manufacturing method. SOLUTION: The wiring board 10 at least includes a conductive film 13 provided on one of surfaces 11a of a base material 11 and made of conductive particles 15, and a metallic layer 14 provided on the conductive film 13. Roughness of a surface 13a of the film 13 in contact with the metallic layer 14 is specified to be 10 μm or less. COPYRIGHT: (C)2007,JPO&INPIT