ELECTRONIC COMPONENT WITH LEAD USING LEAD-FREE SOLDERING

ELECTRONIC COMPONENT WITH LEAD USING LEAD-FREE SOLDERING

PROBLEM TO BE SOLVED: To solve the problem that a flow process executed after a reflow soldering process causes a warp of a board, solder remelting, etc., due to heat from flow soldering, thus leading to the separation of an electronic component. SOLUTION: A semiconductor device includes a semicondu...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: NAKATSUKA TETSUYA, SERIZAWA KOJI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To solve the problem that a flow process executed after a reflow soldering process causes a warp of a board, solder remelting, etc., due to heat from flow soldering, thus leading to the separation of an electronic component. SOLUTION: A semiconductor device includes a semiconductor chip having a plurality of electrodes, a plurality of leads connected electrically to the electrodes of the semiconductor chip via bonding wires, and a resin on which the semiconductor chip is mounted. The leads is composed of two or more kinds of leads different in rigidity. COPYRIGHT: (C)2007,JPO&INPIT