COMPOSITE BOARD AND MANUFACTURING METHOD THEREFOR, AND EL ELEMENT PANEL USING COMPOSITE BOARD

PROBLEM TO BE SOLVED: To provide a composite board having a plurality of layers and a manufacturing method for the composite board which eliminate a sharp film thickness change at the end of a dielectric layer that may cause a crack on an electrode, etc., on a board to trigger the breakage of a wiri...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KUTSUKAKE MASAKI, TERAUCHI NOBUYUKI
Format: Patent
Sprache:eng
Schlagworte:
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