COMPOSITE BOARD AND MANUFACTURING METHOD THEREFOR, AND EL ELEMENT PANEL USING COMPOSITE BOARD
PROBLEM TO BE SOLVED: To provide a composite board having a plurality of layers and a manufacturing method for the composite board which eliminate a sharp film thickness change at the end of a dielectric layer that may cause a crack on an electrode, etc., on a board to trigger the breakage of a wiri...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!