COMPOSITE BOARD AND MANUFACTURING METHOD THEREFOR, AND EL ELEMENT PANEL USING COMPOSITE BOARD

PROBLEM TO BE SOLVED: To provide a composite board having a plurality of layers and a manufacturing method for the composite board which eliminate a sharp film thickness change at the end of a dielectric layer that may cause a crack on an electrode, etc., on a board to trigger the breakage of a wiring electrode, and to provide an EL element panel using the composite board. SOLUTION: The composite board 1 has a structure formed by laminating a first electrode layer 5 formed into a predetermined pattern on a board 3, a thick dielectric layer 7 formed on the first electrode layer 5, and a thick dielectric layer 9 formed on the thick dielectric layer 7, in this order. The end of the thick dielectric layer 9, which is the uppermost layer on the composite board 1, covers the end of the thick dielectric layer 7, which is an under layer, to be formed on the board 3. The EL element panel is made by laminating a light-emitting layer, a thin dielectric layer, and a second electrode layer on the composite board 1. This configuration offers the composite board 1 having a plurality of layers and the manufacturing method for the composite board 1 which eliminate a sharp film thickness change at the end of the dielectric layer that may cause a crack on an electrode, etc., on the board 3 to trigger the breakage of a wiring electrode, and the EL element panel using the composite board. COPYRIGHT: (C)2007,JPO&INPIT