MANUFACTURING METHOD OF METAL CLAD LAMINATED SHEET

PROBLEM TO BE SOLVED: To provide a manufacturing method of a metal clad laminated sheet, which is suitably used in a flexible printed wiring board or the like and composed of at least a conductor and a plurality of polyimide layers, having drastically higher productivity as compared with that of a c...

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Bibliographische Detailangaben
Hauptverfasser:	YANAGIDA MASAMI, UEJIMA KENJI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a manufacturing method of a metal clad laminated sheet, which is suitably used in a flexible printed wiring board or the like and composed of at least a conductor and a plurality of polyimide layers, having drastically higher productivity as compared with that of a conventional method. SOLUTION: The manufacturing method of the metal clad laminated sheet wherein at least two kinds of the polyimide layers are provided on the conductor includes a process for forming at least two layers by casting at least two kinds of solutions, each of which is a solution selected from a solution containing a precursor of a polyimide resin and a solution containing the polyimide resin and contains a solution containing at least one kind of the precursor of the polyimide resin, on the conductor by coextrusion and is characterized in that a chemical dehydrating agent and a catalyst are added to the solution containing at least one kind of the precursor of the polyimide of the solutions used in coextrusion. COPYRIGHT: (C)2007,JPO&INPIT