LIGHT EMITTING DIODE USING METAL DIFFUSION BONDING TECHNOLOGY AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide a light emitting diode using a metal diffusion bonding technology capable of increasing reliability and performance of a product, and to provide a method therefor. SOLUTION: The light emitting diode using a metal diffusion bonding technology comprises: a second condu...

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Bibliographische Detailangaben

Hauptverfasser:	SUNG YING, CHEN YI-HSIUNG, O SHOKIN, CHIU SHIH-YU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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