PROCESSING BOARD, AND METHOD OF MANUFACTURING PRODUCT BOARD

PROBLEM TO BE SOLVED: To provide a processing board (board for mounting) in which a material yield is not lowered and a push back product board (printed circuit board) is very easily removed, and to provide a method of manufacturing a product board from such a processing board. SOLUTION: A processing board 10 comprises: a frame 14; product boards 12a, 12b which are punched out from a mother board including the frame 14, and are inserted in an original hole; concave slots 16a, 16b which are formed in the frame 14 so that both ends thereof may communicate with a perimeter of the frame 14; and first through-holes 18 which intersect with the concave slots 16a, 16b, and is formed in the frame 14 so as not to communicate with the perimeter of the frame 14. A minimal distance between a perimeter of the first through-holes 18 and perimeters of the product boards 12a, 12b is shorter than any of a minimal distance between the first through-holes 18 and the perimeter of the frame 14, a minimal distance between the product boards 12a, 12b, and a minimal distance between the perimeters of the product boards 12a, 12b and the perimeter of the frame 14. The method of manufacturing the product board is also disclosed using this processing board 10. COPYRIGHT: (C)2007,JPO&INPIT