PLASMA ETCHING APPARATUS AND METHOD OF FORMING INNER WALL IN PLASMA PROCESSING CHAMBER

PROBLEM TO BE SOLVED: To prevent aluminum base materials forming an etching chamber or components therein from being corroded, as well as the degradation of productivity due to scattering thermal spraying in a plasma etching apparatus. SOLUTION: In the plasma etching apparatus, an anode oxide film i...

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Bibliographische Detailangaben
Hauptverfasser:	KAWAGUCHI TADAYOSHI, FURUSE MUNEO, ARAI MASATSUGU, SUMIYA MASANORI, MATANO KATSUJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To prevent aluminum base materials forming an etching chamber or components therein from being corroded, as well as the degradation of productivity due to scattering thermal spraying in a plasma etching apparatus. SOLUTION: In the plasma etching apparatus, an anode oxide film is arranged in the etching processing chamber made of aluminum alloy and between components in the etching processing chamber and a ceramics thermal spraying film superior in plasma resistance. The anode oxide film is made to be 5 μm or less in thickness and have heat resistance. COPYRIGHT: (C)2007,JPO&INPIT