SEMICONDUCTOR DEVICE
PROBLEM TO BE SOLVED: To obtain a semiconductor device having chip-on-chip structure, which can be connected direct to a printed board or the like, without using a base board. SOLUTION: The chip-on-chip structure is formed with a semiconductor element 1 and a semiconductor chip 21 joined to the surf...
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| Zusammenfassung: | PROBLEM TO BE SOLVED: To obtain a semiconductor device having chip-on-chip structure, which can be connected direct to a printed board or the like, without using a base board. SOLUTION: The chip-on-chip structure is formed with a semiconductor element 1 and a semiconductor chip 21 joined to the surface of the semiconductor element 1. Bump electrodes 6 are arranged outside a region where the semiconductor chip 21 on the surface of the semiconductor element 1 is joined. The bump electrodes 6 are connected with bump metals 8 which penetrate through-holes 1a of the semiconductor element 1, through wirings 7. COPYRIGHT: (C)2007,JPO&INPIT |
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