BONDING HEAD OF BONDING DEVICE

PROBLEM TO BE SOLVED: To provide a bonding head of a bonding device capable of reducing an operation error to stabilize an action, and simplifying a constituent component by making it compact. SOLUTION: A bonding head of a bonding device includes: a LM (linear motor) guide fitted to a back frame; a first moving block movably connected to the LM guide; a first drive unit to linearly move the first moving block; a first linear motor fitted to the first moving block; a second moving block movably connected to the first moving block in a direction forming a right angle to a moving direction of the first moving block; a transfer unit transferring a linear driving force of the first linear motor to the second moving block; a head provided with a tool for picking up a chip and rotatably connected to the second moving block; and a rotary driving unit for rotating the head. COPYRIGHT: (C)2007,JPO&INPIT