LED PACKAGE AND LIGHT-EMITTING DEVICE USING THE SAME, AND MANUFACTURING METHOD OF LED PACKAGE

LED PACKAGE AND LIGHT-EMITTING DEVICE USING THE SAME, AND MANUFACTURING METHOD OF LED PACKAGE

PROBLEM TO BE SOLVED: To provide a LED package that has the same optical characteristics, is at a low cost, and has improved mass productivity, and to provide a light-emitting device and a manufacturing method of the LED package. SOLUTION: An LED chip 11 is packaged on an FPC 15 in which a light lea...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: NAGAI MASAKAZU, KAJIURA NOBUTAKA, KONISHI YASUHIRO
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a LED package that has the same optical characteristics, is at a low cost, and has improved mass productivity, and to provide a light-emitting device and a manufacturing method of the LED package. SOLUTION: An LED chip 11 is packaged on an FPC 15 in which a light leakage prevention material 16 is provided to compose a COF 22. A reflection mirror package 10 with the inclined surfaces of four surfaces of a worked part in an inverted quadrangular pyramid shape formed on a silicon substrate 1 as a reflection mirror surface is placed on the COF 22 for sealing by a resin material. A reflection mirror surface 9 with a taper angle of 54.7° is formed in four directions. Light emitted from the LED chip 11 is radiated to a side opposite to a packaging surface. COPYRIGHT: (C)2007,JPO&INPIT