METHOD FOR PRODUCING ELECTRONIC CIRCUIT BOARD AND DEVICE THEREFOR

PROBLEM TO BE SOLVED: To convey an electronic circuit board without generating sags and wrinkles therein. SOLUTION: In the method for producing an electronic circuit board comprising a process where one side of a continuous electronic circuit board 3 is clamped with a plurality of clampers 25, and t...

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Bibliographische Detailangaben
Hauptverfasser: KUSAKAI JIYUNICHI, IWASAKI SHOJI, HOSOYA KOJI, SUKETA TSUTOMU
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To convey an electronic circuit board without generating sags and wrinkles therein. SOLUTION: In the method for producing an electronic circuit board comprising a process where one side of a continuous electronic circuit board 3 is clamped with a plurality of clampers 25, and the electronic circuit board 3 is sagged in an almost vertical posture, so as to be conveyed, and the electronic circuit board 3 is plated in a plating tank 7, air is blown on both the faces of the electronic circuit board 3 from both the face sides of the electronic circuit board 3 to both the faces of the electronic circuit board 3 by air blowing apparatuses 27 toward a direction opposite to the conveying direction, and tension is generated to the electronic circuit board 3 on the rear side in the conveying direction, so as to smooth out sags and wrinkles, and thereafter, the electronic circuit board 3 is clamped with the clampers 25, so as to be plated. COPYRIGHT: (C)2007,JPO&INPIT