METHOD FOR PRODUCING ELECTRONIC CIRCUIT BOARD AND DEVICE THEREFOR
PROBLEM TO BE SOLVED: To convey an electronic circuit board without generating sags and wrinkles therein. SOLUTION: In the method for producing an electronic circuit board comprising a process where one side of a continuous electronic circuit board 3 is clamped with a plurality of clampers 25, and t...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To convey an electronic circuit board without generating sags and wrinkles therein. SOLUTION: In the method for producing an electronic circuit board comprising a process where one side of a continuous electronic circuit board 3 is clamped with a plurality of clampers 25, and the electronic circuit board 3 is sagged in an almost vertical posture, so as to be conveyed, and the electronic circuit board 3 is plated in a plating tank 7, air is blown on both the faces of the electronic circuit board 3 from both the face sides of the electronic circuit board 3 to both the faces of the electronic circuit board 3 by air blowing apparatuses 27 toward a direction opposite to the conveying direction, and tension is generated to the electronic circuit board 3 on the rear side in the conveying direction, so as to smooth out sags and wrinkles, and thereafter, the electronic circuit board 3 is clamped with the clampers 25, so as to be plated. COPYRIGHT: (C)2007,JPO&INPIT |
---|