MANUFACTURING METHOD OF CIRCUIT DEVICE

MANUFACTURING METHOD OF CIRCUIT DEVICE

PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit device wherein a conductive foil is finely etched using a film-like resist film. SOLUTION: The film-like resist 41 is in close contact with the surface of the conductive foil 40 in a vacuum chamber 50. When stacking the resist 41 o...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SAKANO JUN, TANEMA TAKESHI, KUZUU TOMOHIRO, HASEGAWA TAKAYUKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit device wherein a conductive foil is finely etched using a film-like resist film. SOLUTION: The film-like resist 41 is in close contact with the surface of the conductive foil 40 in a vacuum chamber 50. When stacking the resist 41 on the conductive foil 40, the resist 41 is pressed by a balloon 55 arranged inside the vacuum chamber 50. Therefore, voids never exist between the film-like resist 41 and the conductive foil 40, and thereby etching can be carried out well. COPYRIGHT: (C)2007,JPO&INPIT