LOW DIELECTRIC LOSS RESIN, RESIN COMPOSITION, AND METHOD FOR PRODUCING LOW DIELECTRIC LOSS RESIN

PROBLEM TO BE SOLVED: To provide a low dielectric loss resin composition having a low dielectric loss comparable to that of a commercially available polyphenylene ether, being soluble at room temperature in general-purpose solvents with low boiling points, being excellent in the processability as a...

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Hauptverfasser:	NUNOE JUN, UEDA MITSURU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON CONDUCTORS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a low dielectric loss resin composition having a low dielectric loss comparable to that of a commercially available polyphenylene ether, being soluble at room temperature in general-purpose solvents with low boiling points, being excellent in the processability as a wiring substrate, and having a narrow molecular weight distribution. SOLUTION: The thermoplastic low dielectric loss resin is a polyphenylene ether random copolymer having an unsaturated bond on a side chain, wherein the molecular weight distribution of the resin is less than 10, more preferably, 5 or less, and particularly preferably 3 or less. The cured products of the resin, the resin composition containing the resin, electronic parts containing the resin, and a method for synthesizing the resin are also provided herein. COPYRIGHT: (C)2007,JPO&INPIT