METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device for improving the joint strength of a pad and a wire on a chip. SOLUTION: This method for manufacturing a semiconductor device comprises: a bonding process for bonding a chip through a boding layer on a wiring board;...

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Bibliographische Detailangaben
Hauptverfasser:	SHIMOKAWA HIROTAKA, IZUMI TADAO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device for improving the joint strength of a pad and a wire on a chip. SOLUTION: This method for manufacturing a semiconductor device comprises: a bonding process for bonding a chip through a boding layer on a wiring board; and a wire binding process for bonding a wire to a pad on the chip while impressing ultrasonic vibration after the bonding process. A bonding layer whose elastic module in a process temperature in the wiring bonding process is 100 MPa or more, is used as the bonding layer. COPYRIGHT: (C)2007,JPO&INPIT