LOW HEAT-SHRINKING AND HIGHLY ADHESIVE POLYIMIDE FILM AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a polyimide film that exhibits improved heat shrinkage and enhanced adhesive properties, and its manufacturing method. SOLUTION: The low heat-shrinking and highly adhesive polyimide film is formed from p-phenylenediamine, 4,4'-diaminodiphenyl ether and pyromelli...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ISHIKAWA HIRONORI, YASUDA MASABUMI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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