LOW HEAT-SHRINKING AND HIGHLY ADHESIVE POLYIMIDE FILM AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a polyimide film that exhibits improved heat shrinkage and enhanced adhesive properties, and its manufacturing method. SOLUTION: The low heat-shrinking and highly adhesive polyimide film is formed from p-phenylenediamine, 4,4'-diaminodiphenyl ether and pyromelli...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ISHIKAWA HIRONORI, YASUDA MASABUMI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a polyimide film that exhibits improved heat shrinkage and enhanced adhesive properties, and its manufacturing method. SOLUTION: The low heat-shrinking and highly adhesive polyimide film is formed from p-phenylenediamine, 4,4'-diaminodiphenyl ether and pyromellitic dianhydride and has a surface free energy of at least 80 mN/m as measured by the contact angle method and a heat shrinkage of at most 0.10% at 200°C for 1 hr. COPYRIGHT: (C)2007,JPO&INPIT