THERMAL HEAD AND THERMAL PRINTER

PROBLEM TO BE SOLVED: To provide a thermal head which permits an improvement of connection reliability and a thermal printer with the thermal head. SOLUTION: A slit 12, one end of which is opened, is provided near a portion superposed on a head board 2 and a connection area including a wiring termin...

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1. Verfasser: SHINTANI SHIGETAKA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a thermal head which permits an improvement of connection reliability and a thermal printer with the thermal head. SOLUTION: A slit 12, one end of which is opened, is provided near a portion superposed on a head board 2 and a connection area including a wiring terminal 10 to be connected to a wiring terminal 7 and the peripheral portion of the wiring terminal 10. The slit 12 can lessen the concentration of stress on the end of the connection area and restrain separation in the connection area, thereby improving connection reliability. COPYRIGHT: (C)2007,JPO&INPIT