DEVELOPING METHOD AND DEVELOPING DEVICE

PROBLEM TO BE SOLVED: To prevent the variation in developing pattern size near one end of a substrate and that near the other end due to a time difference in the feed of a developer, in a developing method using a developing apparatus for scanning a semiconductor substrate having an exposed photosensitive resin film with a rod-like developer jetting nozzle having a size corresponding to the diameter of the semiconductor substrate, in the still state of the substrate. SOLUTION: In moving the rod-like nozzle while discharging the developer from the nozzle to the substrate with the substrate in a still state, the nozzle is moved from one end P1 of the substrate to the other end P2, and after that, the nozzle is moved from the one end P2 of the substrate to the other end P1 to reciprocate the nozzle. In this way, since the application states of the developer for the substrate become symmetric, the developing time in the P1 and P2 accordingly becomes substantially the same, the uniformity of development can be improved, and variation in dimension of the developing pattern reduces. COPYRIGHT: (C)2007,JPO&INPIT