TOOLING OBJECT, MEASUREMENT APPARATUS AND EXPOSURE APPARATUS, AND MEASUREMENT METHOD AND ADJUSTMENT METHOD

PROBLEM TO BE SOLVED: To realize high accurate image vibration measurement in an exposure apparatus. SOLUTION: A space image measuring instruments 25A-25E are located on a tool wafer WT, and the tool wafer WT is located on a wafer holder WH in place of a wafer actually used in exposing, thereby carr...

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Bibliographische Detailangaben
1. Verfasser:	UMAGOME NOBUTAKA
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To realize high accurate image vibration measurement in an exposure apparatus. SOLUTION: A space image measuring instruments 25A-25E are located on a tool wafer WT, and the tool wafer WT is located on a wafer holder WH in place of a wafer actually used in exposing, thereby carrying out the space image measurement for image vibration measurement at a position where the wafer exists when actually exposed. Thus, since a space image can be measured in the same stage condition to an actual exposure, the exact image vibration measurement can be performed in the same circumstance to an actual exposure. COPYRIGHT: (C)2007,JPO&INPIT