MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To prevent the breakdown of a semiconductor wafer when a glass board is anode-joined with the semiconductor wafer with a semiconductor element formed thereon. SOLUTION: A board is prepared in which pads 50 for an anode junction are formed to some of a large number of semiconduc...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KANAMARU TOSHITAKA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!