MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To prevent the breakdown of a semiconductor wafer when a glass board is anode-joined with the semiconductor wafer with a semiconductor element formed thereon. SOLUTION: A board is prepared in which pads 50 for an anode junction are formed to some of a large number of semiconductor chips 20 formed to the semiconductor wafer 30 and sets of wiring 60 for a contact connected to the pads 50 for the anode junction are formed to scribing lines 40. Each of projections 221 to 224 is pushed against the pads 50 for the anode junction on the semiconductor wafer 50 respectively by using weighting members 220 with the fitted projections 221 to 224, for applying a weighting to the semiconductor wafer 30 at places corresponding to the pads 50 for the anode junction fitted to the semiconductor wafer 30, and the semiconductor wafer 30 and the glass board 10 are anode-joined. COPYRIGHT: (C)2007,JPO&INPIT