PRESSURE SENSOR

PROBLEM TO BE SOLVED: To reliably perform bonding between a diaphragm and a substrate, and to heighten reliability of connection between a lead member and an electrode. SOLUTION: Electrode extraction parts 22-1, 23-1 from electrodes 22, 23 to a circumferential part are formed on a diaphragm 20 of th...

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Bibliographische Detailangaben
Hauptverfasser: TASAI YOSHIAKI, YAJIMA TSUTOMU
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To reliably perform bonding between a diaphragm and a substrate, and to heighten reliability of connection between a lead member and an electrode. SOLUTION: Electrode extraction parts 22-1, 23-1 from electrodes 22, 23 to a circumferential part are formed on a diaphragm 20 of this pressure sensor formed by bonding the substrate 10 to the diaphragm 20. An insulating adhesive 26 is applied onto the circumferential part of the diaphragm 20, and an extraction part 26-1 of the insulating adhesive is also applied between the electrode extraction parts. An orientation flat part is provided on a part corresponding to the substrate 10, and a recessed groove to which the lead member is connected by a conductive adhesive is provided there. When bonding the substrate 10 to the diaphragm 20 and connecting the lead member to the recessed groove, since the extraction part 26-1 of the insulating adhesive is formed between the electrode extraction parts, a short circuit between the electrode extraction parts caused by the conductive adhesive for connecting the lead member can be prevented. COPYRIGHT: (C)2007,JPO&INPIT