LOW-PRESSURE PROCESSING DEVICE, METHOD FOR DISMANTLING LOW-PRESSURE PROCESSING DEVICE, AND SUBSTRATE PROCESSING EQUIPMENT

PROBLEM TO BE SOLVED: To provide a low-pressure processing device for processing substrates, with shortened shutdown time and superior productivity and economical efficiency, and to provide a method for dismantling the low-pressure processing device and substrate processing equipment. SOLUTION: A lo...

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1. Verfasser:	KO TEIKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING DRYING DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a low-pressure processing device for processing substrates, with shortened shutdown time and superior productivity and economical efficiency, and to provide a method for dismantling the low-pressure processing device and substrate processing equipment. SOLUTION: A low-pressure processing device for processing substrates comprises a base; a stage that is installed on the base to support a substrate; a housing that is detachably installed on the base to move between a first position and a second position and form a chamber receiving the stage with the base, when it is located at the first position; and at least one first roller set for making contact with the housing to support it and helping the movement of it in the first horizontal direction, when the housing is detached. COPYRIGHT: (C)2007,JPO&INPIT