TUNGSTEN COMPOUND AND MOLYBDENUM COMPOUND AND USE THEREOF FOR CVD (CHEMICAL VAPOR DEPOSITION)

PROBLEM TO BE SOLVED: To provide a further new precursor, especially the precursor of a WN (tungsten nitride) layer having no conventional disadvantage or bringing about a marked improvement over at least the well-known precursor. SOLUTION: A compound is represented by general formula (I) [wherein,...

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Hauptverfasser: SUNDERMEYER JORG, ALEXEI MERKOULOV, VOLZ KERSTIN, OCHS THOMAS, POKOJ MICHAEL, REUTER KNUD, STOLZ WOLFGANG
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creator SUNDERMEYER JORG
ALEXEI MERKOULOV
VOLZ KERSTIN
OCHS THOMAS
POKOJ MICHAEL
REUTER KNUD
STOLZ WOLFGANG
description PROBLEM TO BE SOLVED: To provide a further new precursor, especially the precursor of a WN (tungsten nitride) layer having no conventional disadvantage or bringing about a marked improvement over at least the well-known precursor. SOLUTION: A compound is represented by general formula (I) [wherein, M, R1, R2, R3, R4, R5and R6have each a specific meaning]. COPYRIGHT: (C)2007,JPO&INPIT
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subjects ACYCLIC OR CARBOCYCLIC COMPOUNDS
ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
ORGANIC CHEMISTRY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
title TUNGSTEN COMPOUND AND MOLYBDENUM COMPOUND AND USE THEREOF FOR CVD (CHEMICAL VAPOR DEPOSITION)
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