WIRING BOARD FOR MOUNTING MILLIMETER-WAVE SEMICONDUCTOR CHIP
PROBLEM TO BE SOLVED: To provide a wiring board for mounting millimeter-wave semiconductor chip, wherein electrostatic breakage are prevented from occurring occurs in a millimeter-wave basic element, even if electrostatic electricity is applied to an external terminal to which a millimeter-wave sign...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a wiring board for mounting millimeter-wave semiconductor chip, wherein electrostatic breakage are prevented from occurring occurs in a millimeter-wave basic element, even if electrostatic electricity is applied to an external terminal to which a millimeter-wave signal is input. SOLUTION: Transmission line conductors 12 and 13 for transmitting a millimeter-wave signal are electrically brought into contact with a silicon board 11 with a resistivity of 0.5-10.5 kΩ cm, to which the millimeter-wave semiconductor chip 14 is mounted, so as to form the wiring board for mounting a millimeter-wave semiconductor chip. When electrostatic electricity is input to an external terminal 16, it is made to flow to an earth conductor 13 via a route formed in the silicon substrate 11. Thus, the electrostatic breakdown voltage of the millimeter-wave semiconductor chip 14 is improved significantly. COPYRIGHT: (C)2007,JPO&INPIT |
---|