DIFFERENTIAL TRANSMISSION PATH STRUCTURE AND WIRING BOARD

PROBLEM TO BE SOLVED: To provide a differential transmission path structure capable of easily acquiring impedance matching and being manufactured in a smaller size, and to provide a wiring board having the differential transmission path structure. SOLUTION: The differential transmission path structu...

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1. Verfasser:	HIGUCHI TSUTOMU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE WAVEGUIDES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a differential transmission path structure capable of easily acquiring impedance matching and being manufactured in a smaller size, and to provide a wiring board having the differential transmission path structure. SOLUTION: The differential transmission path structure comprises an insulated layer, a grounded conductive layer laminated with the insulated layer, and a differential transmission path formed on the insulated layer. It is characterized in that a region, where the conductive layer is removed, is formed in response to the position of the differential transmission path. COPYRIGHT: (C)2007,JPO&INPIT