SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To obtain a semiconductor device a semiconductor element of which can be connected directly to a printed circuit board or the like without using a foundation substrate in packaging the semiconductor element with an element forming face up. SOLUTION: An Al electrode 2 is formed on the element forming face of the substrate 1. A protuberant bump electrode 6 is formed on the Al electrode 2. Further, a bump metal 8 is formed through a through hole 1a formed in the substrate 1. A wiring 7 connects the bump electrode 6 to the bump metal 8. The bump electrode 6, the wiring 7, and the bump metal 8 are formed by plating in the same process. This makes the wiring 7 have a thickness corresponding to the height of the bump electrode 6. COPYRIGHT: (C)2007,JPO&INPIT