HEAT RADIATOR AND ELECTRONIC EQUIPMENT USING THE SAME

PROBLEM TO BE SOLVED: To provide a heat radiator for carrying out the heat radiation of heating components arranged in the periphery of a heat sink, and in detail, a heat radiator for performing the heat radiation of the heating components arranged in the neighborhood of an air flow channel at the d...

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Bibliographische Detailangaben
Hauptverfasser: FUJIWARA TAKESHI, IZUMITANI YUKIO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a heat radiator for carrying out the heat radiation of heating components arranged in the periphery of a heat sink, and in detail, a heat radiator for performing the heat radiation of the heating components arranged in the neighborhood of an air flow channel at the downstream side of a fan. SOLUTION: A plurality of heat radiating components are mounted on a mother board 1, and a heat sink 10 is mounted on at least one heating component. The heat sink 10 is provided with a fan 12 arranged on the upstream side of the position where it is brought into contact with the heating component; an air flow channel 13 arranged on the downstream side of the position where it is brought into contact with the heating component; and one or more through-holes 22 formed on a face plate configuring the air flow channel 13. Air intake is carried out by the fan 12 and also from the through-hole 22 so that it is possible to perform the heat radiation of the periphery of the through-hole. COPYRIGHT: (C)2007,JPO&INPIT