GUARD RING AND PRE-PROCESSED SEMICONDUCTOR WAFER EQUIPPED THE SAME
PROBLEM TO BE SOLVED: To provide a guard ring capable of determining whether the electrostatic charge has occurred in the amount which may have the adverse effect on integrated circuits in the pre-processing step of a semiconductor wafer, as well as to provide a pre-processed semiconductor wafer equ...
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Sprache: | eng |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a guard ring capable of determining whether the electrostatic charge has occurred in the amount which may have the adverse effect on integrated circuits in the pre-processing step of a semiconductor wafer, as well as to provide a pre-processed semiconductor wafer equipped with such a guard ring. SOLUTION: In configuration of a guard ring 40 which is attached around an integrated circuit 20 formed on a semiconductor wafer 1 for guarding the integrated circuit mechanically and electrically, floating wires 25, 30 and 35 which are electrically separated from the semiconductor wafer 1 are attached on the corresponding interlayer dielectric layers for each of the interlayer dielectric layers 9 and 13, while potential fixed discharging terminals 28, 33 and 38 which are electrically connected with the semiconductor wafer 1 are attached near the corresponding floating wires for each of the floating wires. COPYRIGHT: (C)2007,JPO&INPIT |
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