METHOD FOR MANUFACTURING SOLID-STATE IMAGING APPARATUS, AND SOLID STATE IMAGING APPARATUS

PROBLEM TO BE SOLVED: To provide a method for manufacturing a solid-state imaging apparatus which can attain an accurate alignment. SOLUTION: The method includes a step of preparing a semiconductor substrate having an alignment mark 32 formed thereon within a region 18d outside of a pixel region, a first formation step of forming a first λ/4 multilayer film 34 made of a plurality of dielectric layers, a second formation step of forming an insulator layer 42 on the first λ/4 multilayer film 34, an adjustment step of adjusting the optical film thickness of the insulator layer 42 positioned above the alignment mark to such a thickness as to enable transmission of alignment light, and a third formation step of forming a second λ/4 multilayer film 38 made of a plurality of dielectric layers on an insulator layer 36 having the adjusted thickness. COPYRIGHT: (C)2007,JPO&INPIT