IMAGING ELEMENT

PROBLEM TO BE SOLVED: To mount an imaging element having lead terminals arranged on four sides of a rectangular body precisely and easily on a circuit board. SOLUTION: Each of one set of lead terminals on the opposite sides of an image sensor 10 is formed of a surface mounting terminal 2, and each of another set of lead terminals on the opposite sides is specified as a substrate penetration lead terminal 3. On a corresponding mounting circuit board 11, a conductor pattern is formed at a position where the surface mounting lead terminal 2 is fixed, and a circular through-hole is formed at a position where the substrate penetration lead terminal 3 is fixed. Positioning of the image sensor 10 when it is mounted on a substrate is performed by the substrate penetration lead terminal 3 arranged only on one set of opposite sides. As compared with a case where the substrate penetration lead terminals 3 are employed entirely on four sides, insertion into the through-hole of the board 11 is facilitated without relying upon a tool. Since no rotation is required after fixing, high precision positioning is ensured. COPYRIGHT: (C)2007,JPO&INPIT