SAMPLE HEATING DEVICE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To prevent a crack generated at a ceramic junction layer 6 of a ceramic heater 2 and a ceramic cylindrical support body 8 due to heat cycles accompanied by repetitive heating and cooling. SOLUTION: The sample heating device 1 is so structured that a jutted part 3a is provided a...

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1. Verfasser: NAKAMURA TSUNEHIKO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To prevent a crack generated at a ceramic junction layer 6 of a ceramic heater 2 and a ceramic cylindrical support body 8 due to heat cycles accompanied by repetitive heating and cooling. SOLUTION: The sample heating device 1 is so structured that a jutted part 3a is provided at the center of a surface opposite to a mounting face 5 of the ceramic heater having one of the main faces of a platy ceramic body 3 embedding a resistive heating element 4 as the mounting face 5 of the wafer W, a power-feeding terminal 9 is provided at the jutted part 3a to be electrically connected with the resistive heating element, the ceramic cylindrical support body 8 is integrally jointed through the ceramic junction layer 6 with the power-feeding terminal 9 so as to surround it by sintering, and at the same time, the sample heating device is constructed so that an outer periphery face of the jutted part 3a, an outer periphery face of a jointed part of the ceramic cylindrical body 8, and an outer periphery face of the junction layer 6 are formed into a continuously connected surface. COPYRIGHT: (C)2007,JPO&INPIT